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Diamond Dicing Blades

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Manufactured with selected diamond particles with a metal matrix matched to the application. Provides longer tool life and lower cost.

*FEATURES
High accuracy, super thin blade developed with RockWell's
own technology. Closely sized micron diamond reduces chipping to an absolute minimum. No initial boird dressing required. Easy to handle.
*APPLICATION
Designed for high efficency dicing of silicon and other electro-ceramic materials.

*SPECIFICATION

Type
H
Hub Type
R
Ring Type
Grit Size (um)
B
1~2
C
2~4
D
2~6
E
4~6
F
4~8
Kerf Width (um)
20
15~20
50
20~25
30
25~30
35
30~35
40
35~40
50
40~50
60
50~60
70
60~70
Exposure (um)
40
400~500
50
500~600
60
600~700
70
700~800
80
800~900
90
900~1000
100
1000~1100
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*AVAILABLE SPECIFICATION

Exposure
40
50
60
70
80
90
100
Kerp width
(mil)
(mil)
15.7~19.7
19.7~23.6
23.6~27.6
27.6~31.5
31.5~35.4
35.4~39.4
39.4~43.3
(um)
400~500
500~600
600~700
700~800
800~900
900~1000
1000~1100
20
0.6~0.8
15~20
HE2040
.
.
.
.
.
.
25
0.8~1.0
20~25
HE2540
HE2550
HE2560
.
.
.
.
30
1.0~1.2
25~30
HE3040
HE3050
HE3060
HE3070
.
.
.
35
1.2~1.4
30~35
.
HE3550
HE3560
HE3570
HE3580
.
.
40
1.4~1.6
35~40
.
.
HE4060
HE4070
HE4080
HE4090
.
50
1.6~2.0
40~50
.
.
.
HE5070
HE5080
HE5090
HE50100
60
2.0~2.4
50~60
.
.
.
.
HE6080
HE6090
HE60100
70
2.4~2.8
60~70
.
.
.
.
.
HE7090
HE70100
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