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Silicon Wafer Edge Grinding Wheels

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Used to granding the edge of silicon wafers. *FEATURES
Edge grinding of silicon wafers and other semi-conductor materials in the most demanded high precision applications. Provides high cutting speed and long wheel life. Eliminate chip breaking during the grinding operation.
*APPLICATION
Bevel edge grinding of silicon wafers, other semiconductor materials.
*SPECIFICATION

*SPECIFICATION (Unit:mm )

Outer Diameter
SINGLE GRIT #800 (20~30um)
4"
6"
SINGLE GRIT #800 (20~30um)
DUAL GRIT #800 (20~30um), #1200 (10~20um)

 

Outer Diameter
H
Tn
T
GROOVE
Bond
4"
20
1.5~2.5
8~9
1~3
Electroplated
Metal
8"
30
2.0~2.5
14~16
5~6
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