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Silicon Wafer Back Grinding Wheels

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Used for trimming of silicon wafers.


*WHEEL SIZE (unit:mm)

Division
Out Diameter (D)
Tip Width (W)
Depth (X)
Rough
204
2-5
5
250
300
350
Finish
204
250
300
350

*SPECIFICATION

Divsion
Grit Size
Bond
R-Rough
D40/60 (#325)
RA
?
D22/36 (#600)
RB
?
D5/10 (#1200)
VA
?
D4/8 (#1500)
VB
?
D3/8 (#1800)
SWA
?
D4/6 (#2000)
SWB
?
D3/6 (#3000)
?
?
D2/4 (#4000)
?

*BOND CHARACTERISTIC

Divsion
Iudication
Characteristic
Rough
RA
Elastic resin bond
RB
Lubricant resin bond
VA
Non-porous resin bond
VB
Fine-pore resin bond
Finish
SWA
Wear resistant resin bond
SWB
Free cutting resin bond
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