CMP Pad Conditioners are used for dressing poly-urethane based CMP pads. EHWA produces pad conditioners by three methods. BSL (brazed single layer) Electroplated. NEW BSL type (double metal layer).
BSL products provide very fast removal rate as a result of the chemical bonding of the abrasive grit to a stainless steel body and the resuiting increased chip clearance. Electrolated products provide improved flatness and better surface finish.
The NEW BSL type has a double metal layer. The first layer provides excellent diamond retention and the second layer provides a clean surface that minimizes micro-scratches. The NEW BSL type conditioner combines the best features of both giving rapid stock remval while providing a clean surface that minimizes micro-scratches and provides improved flatness.
DESCRIPTION OF ROCKWELL CMP PAD CONDITIONER
| Classification | Abrasive bonding | Distinctive features |
Brazed SingleLayer (BSL) | Chemical reaction | *Chip pocket : good circutation of'slurry ..and'swarf. *Excallent Diamond Bonding : prevents ..diamond pull out. *Diamond protrusion : good removal rate. |
Electroplated | Mechanical tightening | *Good flatness : minimize micro scratching. *Good wear resistance : lesscontamination. |
NEW BSL Type (Double Metal Layer) | Chemical + Mechanical bonding | *Merits of Brazed Single Layer and |
APPLICATION
| Mahines (MODEL) | Polished materials | Available grit size |
AMAT(Mirra) SpeedFam / IPEC (Auriga, CMP 200 / 300, Avantgaard 776, 876) Ebara (EPO-222 (H), 333) Strasbaugh (6DS-SP , 6ED) Lam (Teres. ect. | Oxide CMP : (BPSG, TEOS, PSG) Metal CMP : (AL, W, Cu) STI, PGI, Poly-Si CMP | #30 / 40 - #120 / 140 (Mash) |
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